高精密半导体设备的零部件CNC加工 类型007(High-Precision Semiconductor Device Parts CNC Machining Type007)
高精密半导体设备的零部件CNC加工 类型007的规格说明(Specifications)：
- 高精密半导体设备的零部件CNC加工 类型007的加工精度0.01mm.
- 专用于高精密的半导体设备.
- 可以大量供货.
- 价格合理.
High-Precision Semiconductor Device Parts CNC Machining Type007 Specifications：
- High-Precision CNC Machining for Semiconductor Device Components Type 007 machining accuracy is 0.01 mm.
- Dedicated to high-precision semiconductor devices.
- We are capable of supplying in large quantities.
- Reasonable pricing.